Tohoku University Engineering Summer Program (TESP) 2024

Participating in the Tohoku University Engineering Summer Program (TESP) 2024 is welcome. This program offers a unique opportunity for students to immerse themselves in a dynamic academic and cultural experience at one of Japan's leading institutions.

It is highly recommended to take the Materials Engineering course- Bio-Materials Engineering (coordinated by Dr. Masaya Yamamoto and Dr. Mako Kobayashi).

● Program Highlights:

- Engineering courses taught by Tohoku professors

- Hands-on laboratory sessions and group project

- Cultural & social activities to explore the city & Tohoku region

- Networking opportunities with students from around the world

● Program Details (Materials Engineering Course):

- Dates: July 19 to August 2, 2024

- Fee: 140,000 JPY

- Location: Tohoku University, Sendai, Japan -  Application deadline: April 20

Please visit the program website: https://www.ied.eng.tohoku.ac.jp/summer-program